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CLS01
TOSHIBA Schottky Barrier Diode
CLS01
Switching-Mode Power Supply (Secondary-Rectification) Applications (Low Voltage) DC/DC Converter Applications
Unit: mm
* * * *
Forward voltage: VFM = 0.47 V (max) Average forward current: IF (AV) = 10 A Repetitive peak reverse voltage: VRRM = 30 V Suitable for compact assembly due to small surface-mount package: "L-FLATTM" (Toshiba package name)
Absolute Maximum Ratings (Ta = 25C)
Characteristics Repetitive peak reverse voltage Average forward current Non-repetitive peak surge current Junction temperature Storage temperature range Symbol VRRM IF (AV) IFSM Tj Tstg Rating 30 10 (Note 1) 100 (50 Hz) -40~125 -40~150 Unit
A A C C
ANODE
CATHODE

Note 1: T = 88C Rectangular waveform ( = 180), VR = 15 V
JEDEC JEITA

TOSHIBA 3-4F1A Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in Weight: 0.15 g (typ.) temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25C)
Characteristics Symbol VFM (1) Peak forward voltage VFM (2) VFM (3) Peak repetitive reverse current Junction capacitance IRRM (1) IRRM (2) Cj Test Condition IFM = 3.0 A (pulse test) IFM = 5.0 A (pulse test) IFM = 10 A (pulse test) VRRM = 5 V (pulse test) VRRM = 30 V (pulse test) VR = 10 V, f = 1.0 MHz Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (board thickness: 1.6 t) (soldering land) Cathode 5.7 mm x 6.2 mm Anode 4.5 mm x 3.4 mm Min Typ. 0.34 0.38 0.45 8.0 0.1 530 Max 0.47 1.0 A mA pF V Unit
Thermal resistance (junction to ambient)
Rth (j-a)
100
C/W
Thermal resistance (junction to lead)
Rth (j-)
5
C/W
1
2006-11-13
3.20.2
V
CLS01
Marking
Abbreviation Code S01 Part No. CLS01
Standard Soldering Pad
Unit: mm
5.9
2.5
1.8
2.6
4.8
Handling Precautions
1) Schottky barrier diodes have reverse current characteristics compared to other diodes. There is a possibility that SBDs will cause thermal runaway when used under high-temperature or high-voltage conditions. Be sure to take forward and reverse loss into consideration during design. The absolute maximum ratings denote the absolute maximum ratings, which are rated values that must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend for when designing a circuit incorporating this device. VRRM: Use this rating with reference to (1) above. VRRM has a temperature coefficient of 0.1%/C. Take this temperature coefficient into account when designing a device for operation at low temperatures. IF (AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF (AV) and that Tj be below 100C. When using this device, take the margin into consideration by using an allowable Tamax-IF (AV) curve. IFSM: This rating specifies the non-repetitive peak current. This applies only to abnormal operation, which seldom occurs during the lifespan of the device. Tj: Derate this rating when using the device in order to ensure high reliability. We recommend that the device be used at a Tj of below 100C.
2)
3)
Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When using the device, design the circuit board and soldering land size to match the appropriate thermal resistance value. Refer to the databook on Rectifiers for further information.
4)
2.9
2
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CLS01
iF - vF (A)
100 7.0
PF (AV) - IF (AV) Average forward power dissipation PF (AV) (W)
DC 6.0 180 5.0 = 60 4.0 3.0 2.0 1.0 0.0 0 0 360 0 360 Conduction angle Conduction angle 4 8 12 16 Rectangular Rectangular waveform waveform 120
iF
Tj = 125C 10 75C 1
Instantaneous forward current
25C 0.1 Pulse test 0.01 0.0 0.2 0.4 0.6 0.8
Instantaneous forward voltage
vF
(V)
Average forward current
IF (AV)
(A)
T max - IF (AV)
140 140
Ta max - IF (AV) Maximum allowable temperature
Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (board thickness: 1.6 t) (soldering land) Cathode 5.7 mm x 6.2 mm Anode 4.5 mm x 3.4 mm
Maximum allowable lead temperature T max (C)
120 100 80 60 40 20 0 0
120 100
Ta max (C)
= 60 Rectangular waveform
120
180
DC
80 DC 60 40 20 0 0 180 120 = 60 Rectangular waveform
0 360 IF (AV) Conduction angle VR = 15 V 4 8 12 16
0 360 IF (AV) Conduction angle VR = 15 V 8 12 16
4
Average forward current
IF (AV)
(A)
Average forward current
IF (AV)
(A)
rth (j-a) - t
1000 500 300 100 50 30 10 5 3 1 0.5 0.3 0.1 0.001 Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (board thickness: 1.6 t) (soldering land) Cathode 5.7 mm x 6.2 mm Anode 4.5 mm x 3.4 mm 0.003 0.01 0.03 0.1 0.3 1 3 10 30 100 300 1000
Transient thermal impedance rth (j-a) (C/W)
Time
t
(s)
3
2006-11-13
CLS01
Surge forward current Cj - V R
10000
(typ.) (A)
120 Ta = 25C f = 1 MHz
(non-repetitive)
Ta = 25C 100 f = 50 Hz
Cj (pF)
5000
500
Peak surge forward current
1000
IFSM
100
Junction capacitance
80
60
100 50
40
20
10 1
3
5
10
30
50
0 1
3
5
10
30
50
100
Reverse voltage
VR
(V)
Number of cycles
IR - Tj
100 Pulse test
(typ.)
2.0 Rectangular waveform 0 360
PR (AV) - VR
(typ.)
(mA)
10
Average reverse power dissipation
1.5
IR
PR (AV) (W)
1 20 V 10 V 0.01 VR = 5 V
30 V
VR
300 240 180 120
DC
Reverse current
0.1
1.0
Conduction angle Tj = 125C
0.5
0.001
= 60 0.0001 0 20 40 60 80 100 120 140 160 0.0 0 6 12 18 24 30
Junction temperature
Tj
(C)
Reverse voltage
VR
(V)
4
2006-11-13
CLS01
RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
20070701-EN
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
5
2006-11-13

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